Description
* Intelligent desoldering station with precise temperature control.
* Designed to protect the motherboard from overheating.
* Audible alarm when the preset temperature is reached.
* Large heating platform for improved compatibility.
* Supports large motherboard desoldering operations.
* Clear digital temperature display.
* Adjustable temperature with fast heating response.
* Uniform heat distribution for stable performance.
* Long-life heating system.
* Supports Android and iPhone X–17 series motherboard layer separation.
* Suitable for screen bracket separation and motherboard repair.
* Extra-large heating area for smartphones and larger PCBs.
* Optimized air duct design for efficient heat dissipation.
* Strong magnetic adsorption for secure fixture positioning.
* Built-in multiple high-strength magnets.
* Easy installation and quick disassembly.
* Synthetic stone compression clamp for a secure motherboard fit.
* Ideal for smartphone motherboard repair and professional rework.
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